EUTECTIC COPPER – AN INNOVATIVE METHOD FOR PRINTING ELECTRONICS
SKU0024
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DESCRIPTION
Innovative approach to electronics manufacturing, addressing key challenges in photolithography and sputtering. This method leverages eco-friendly deep eutectic solvents and laser technology, ensuring a unique and cost-effective process. A simplified three-step procedure is used to reduce production costs, speed up manufacturing, and require only one setup for all stages. The methodology of the technology is as follows: the metallic or dielectric substrate is pre-treated with a laser. Then, a deep eutectic solvent is applied to it. In areas where tracks and metal are required on the holes, the substrate is treated with laser radiation. After that, the solvent residues are removed with warm water, leaving a metallic contour on the substrate. This technology has already been perfected for applying copper tracks to dielectric substrates and for metallizing holes in them.
CHARACTERISTICS
Structure formation speed – up to 6.5 mm/s
Resistance of 0.15 (Ω ∙ (mm²))/m, which is 100–1000 times lower than values obtained with similar methods
Track width – 300–800 µm
Height – at least 30 µm, with the potential for increase
The method has demonstrated adaptability for substrates made of various materials
ADVANTAGES OF THE DEVELOPMENT
Low cost
Simplified process and high production speed
Low consumption of components
One setup for all operations, no special skills required to work with the method